Event Overview


COMSOL Day @ Universiti Sains Malaysia

Event Sessions

23 May 2018, 9am - 5pm

Venue

Universiti Sains Malaysia

School of Electrical and Electronic Engineering
Level 2, Microcomputer Lab

 

Our hands-on workshops will be coming to Universiti of Sains Malaysia on 23 May 2018 (Wednesday). Our workshops provide educators and those involved in research with a valuable opportunity to learn more about COMSOL Multiphysics and its many applications. With a brief introduction and live demonstration, these workshops are designed to cover the fundamentals of modelling simulations in COMSOL Multiphysics. The hands-on portion of the workshop allows attendees to test drive the software by building a model from scratch, allowing each person to leave with the ability to experiment with their own simulations in COMSOL Multiphysics.

This FREE event is open to anyone who wants to learn about multiphysics modeling and how it can be used for research, teaching and product designs.

REGISTER

You can select to register for either ONE or BOTH of the workshops below:

Array ( [0] => Array ( [time] => 9.00am – 12.00pm [content_title] => [has_sub_content] => 1 [subcontent_link_text] => [subcontent_title] => Electromagnetic Modeling for Low & High Frequency Devices [subcontent_subtitle] => [subcontent_content] =>

This session provides you an introduction to using COMSOL Multiphysics® to design and optimize electromagnetic devices that work at low and high frequencies. You will learn how to simulate devices such as, coils, magnets, transformers, waveguides, fiber optics, photonic crystal, cavities, and metamaterials.

Key contents include:

  • General introduction to the modules for electromagnetics modelling
  • Applications scopes of the modules
  • How to select the appropriate electromagnetic module based on the operating frequency and wave length
  • Infinite element and perfectly matched layer
  • Scattering and far-field calculations
  • Drude-Lorentz, Debye and Sellmeier Dispersion models
  • Meshing Techniques
  • Typical boundary conditions
  • Hands-on exercise: RF Heating
) [1] => Array ( [time] => 2.00pm - 5.00pm [content_title] => [has_sub_content] => 1 [subcontent_link_text] => [subcontent_title] => Structural Mechanics & Heat Transfer Analysis [subcontent_subtitle] => [subcontent_content] =>

This session provides an introduction to the key features in COMSOL’s Structural Mechanics and its add-on modules.

The different structural material models, structural elements and study types will be covered. We will also present on how to add damping and losses. We will discuss the multiphysics interfaces in Structural Mechanics module and the thermal expansion analysis that couples Structural Mechanics with Heat Transfer will be emphasized.

The key contents include:

  • Key features of Structural Mechanics Module and its add-on modules
  • Different structural material models, structural elements and study types
  • The multiphysics interfaces
  • Heat transfer in solids
  • Hands-on exercise: Thermal Microactuator
) )

Workshops

Time Programme
9.00am – 12.00pm

Electromagnetic Modeling for Low & High Frequency Devices

This session provides you an introduction to using COMSOL Multiphysics® to design and optimize electromagnetic devices that work at low and high frequencies. You will learn how to simulate devices such as, coils, magnets, transformers, waveguides, fiber optics, photonic crystal, cavities, and metamaterials.

Key contents include:

  • General introduction to the modules for electromagnetics modelling
  • Applications scopes of the modules
  • How to select the appropriate electromagnetic module based on the operating frequency and wave length
  • Infinite element and perfectly matched layer
  • Scattering and far-field calculations
  • Drude-Lorentz, Debye and Sellmeier Dispersion models
  • Meshing Techniques
  • Typical boundary conditions
  • Hands-on exercise: RF Heating
2.00pm - 5.00pm

Structural Mechanics & Heat Transfer Analysis

This session provides an introduction to the key features in COMSOL’s Structural Mechanics and its add-on modules.

The different structural material models, structural elements and study types will be covered. We will also present on how to add damping and losses. We will discuss the multiphysics interfaces in Structural Mechanics module and the thermal expansion analysis that couples Structural Mechanics with Heat Transfer will be emphasized.

The key contents include:

  • Key features of Structural Mechanics Module and its add-on modules
  • Different structural material models, structural elements and study types
  • The multiphysics interfaces
  • Heat transfer in solids
  • Hands-on exercise: Thermal Microactuator

Note

  • This workshop will require you to bring your own laptop that runs on a 64-bit Operating System. Please visit System Requirements to see the minimum configuration COMSOL requires for installation.
  • Participants will be provided with a FREE 2-week COMSOL product evaluation license after they attend the workshop